synth_tools

Back

SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad, Analog Devices KS-4 (like EIAJ SC-82 Infineon PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug up (https://www.infineon.com/cms/en/product/packages/PG-HDSOP/PG-HDSOP-10-1/ HSOF-8-1 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/ HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/ mosfet hsof toll thermal vias in pads, 2 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator JST XH series connector, LY20-8P-DLT1, 4 Circuits (https://www.molex.com/pdm_docs/sd/2005280040_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2104, With thermal vias in pads, 3 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 4 pin, 2.0mm square SMD pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 3 pin, 2.0mm square SMD pads Net tie, 4 pin, 2.0mm square SMD pads Net tie, 4 pin, 0.5mm square SMD pads Net tie, 2 pin, 0.5mm square SMD pads Net tie, 2 pin, 0.3mm round THT pads Net tie, 2 pin, 0.5mm square SMD rectangular pad as test point, pitch 2.54mm, size 30.9x6.2mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_311711_RT137xxHBWC_OFF-022811Q.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-3-14-5.08, 14 pins, pitch 5mm, size 25x9mm^2, drill diamater 0.7mm, pad diameter 3mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 5267-04A, 4 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0102, With thermal vias HSOF-8-2 [TOLL] power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-2/, https://www.infineon.com/dgdl/Infineon-ApplicationNote_600V_CoolMOS_C7_Gold_TOLL-AN-v01_00-EN.pdf?fileId=5546d4625b10283a015b144a1af70df6 HSOF-8-3 power MOSFET (http://www.infineon.com/cms/en/product/packages/PG-HSOF/PG-HSOF-8-1/ mosfet hsof toll thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator connector wire 0.5sqmm strain-relief Soldered wire connection with double feed through strain relief, for 5 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, S3B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1105, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf.

New Pull Request

Labels Milestones