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Length*width=13.5*4mm^2, Capacitor, http://www.wima.com/EN/WIMA_FKS_3.pdf, http://www.wima.com/EN/WIMA_MKS_4.pdf C Rect series Radial pin pitch 21.80mm length 46mm width 19.1mm Vishay TJ7 L_Toroid, Horizontal series, Radial, pin pitch=5.08*12.70mm^2, , length*width=21*10mm^2, muRATA, 5100, http://www.murata-ps.com/data/magnetics/kmp_5100.pdf L_CommonMode_Toroid Vertical series Radial pin pitch 3.81mm size 22.8x7.3mm^2 drill 0.7mm pad 1.4mm terminal block RND 205-00249, 10 pins, pitch 3.5mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2103, With thermal vias in pads, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-0621 (alternative finishes: 43045-142x), 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST ZE series connector, BM06B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-30DP-2DSA, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Dual Flat No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole straight pin header, 2x02, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x34, 2.00mm pitch, single row style2 pin1 right Through hole angled pin header SMD 2x36 2.00mm double row Through hole angled socket strip, 1x10, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x10, 2.54mm pitch, double rows Through hole angled socket strip, 2x10, 2.54mm pitch, double rows Through hole angled socket strip SMD 1x06 1.00mm single row style2 pin1 right Through hole angled pin header, 2x24, 1.00mm pitch, single row Surface mounted socket strip THT 2x15 2.00mm double.

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