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18.0x18.0mm, 448 Ball, 22x22 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Stretched Small Outline (SS)-5.30 mm Body [TQFP] With Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 8.6, Wuerth electronics 9774030982 (https://katalog.we-online.de/em/datasheet/9774030982.pdf), generated with kicad-footprint-generator connector wire 1sqmm strain-relief Soldered wire connection with double feed through strain relief, for 3 times 2.5 mm² wire, basic insulation, conductor diameter 2.4mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix MKDS-3-3-5.08 pitch 5.08mm size 15.2x11.2mm^2 drill 1.3mm pad 2.6mm Terminal Block 4Ucon ItemNo. 10684 pitch 3.5mm size 32.2x7mm^2 drill 1.2mm pad 3mm single screw terminal block Metz Connect Type175_RT02703HBLC, 3 pins, pitch 2.54mm, package size 11.5x8.5x17.5mm^3, https://www.recom-power.com/pdf/Innoline/R-78HBxx-0.5_L.pdf DCDC-Converter, RECOM, RECOM_R-78B-2.0, SIP-3, pitch 2.54mm, package size 11.6x8.5x10.4mm^3, https://www.recom-power.com/pdf/Innoline/R-78Sxx-0.1.pdf dc-dc recom buck sip-12 pitch 2.54mm length 7mm diameter 3.3mm Fastron MICC Inductor, Axial series, Axial, Horizontal, pin pitch=12.7mm, 0.5W = 1/2W length 9mm width 2.7mm Capacitor C, Rect series, Radial, pin pitch=22.90mm, , diameter=25.4mm, Vishay, TJ5, BigPads, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Horizontal series Radial pin pitch 45.72mm 9W length 38mm width 6.4mm height 6.4mm Resistor, Axial_Power series, Box, pin pitch=38.1mm, 7W, length*width*height=35.3*9.5*9.5mm^3, shunt pin pitch 23.10mm diameter 24.4mm muRATA 1400series Inductor, Radial series, Radial, pin pitch=5.00mm, , diameter=12.0mm, MuRATA, 1900R, http://www.murata-ps.com/data/magnetics/kmp_1900r.pdf Inductor Radial series Radial pin pitch 10.00mm diameter 8mm Fastron 77A Inductor, Axial series, Axial, Horizontal, pin pitch=5.08mm, , length*width=10*5mm^2 L_Toroid Vertical series Radial pin pitch 28.80mm diameter 29.8mm muRATA 1400series Inductor, Radial series, Radial, pin pitch=10.00mm, , length*width=11.5*7.5mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 10.00mm length 11.5mm width 5.6mm Bourns 5700 L_Toroid, Vertical series, Radial, pin pitch=2.50mm, , diameter*width=3.0*1.6mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf C Disc series Radial pin pitch 2.50mm length 4mm diameter 2mm.

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