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4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, http://www.analog.com/media/en/package-pcb-resources/package/57080735642908cp_8_4.pdf LFCSP 8pin 2x2mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled pin header, 1x06, 2.54mm pitch, 8.51mm socket length, double rows Through hole straight socket strip, 1x23, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x09, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x08, 1.27mm pitch, 4.4mm socket length, single row Through hole angled pin header, 2x18, 1.00mm pitch, double rows Through hole angled pin header SMD 1x03 2.54mm single row Through hole straight pin header, 1x16, 2.00mm pitch, 4.2mm pin length, single row Through hole pin.

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