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/ QIP80E CASE 122BS (see ON Semiconductor 506BU.PDF 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=277, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=296, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=91, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic QFN (3mm x 3mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN, 12 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3652fe.pdf#page=24), generated with kicad-footprint-generator JST SH series connector, 14111013010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=43), generated with kicad-footprint-generator Hirose series connector, B15B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-10A2, example for new part number: AE-6410-12A example for new part number: 5273-07A example for new mpn: 39-28-922x, 11 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-10DS-0.5V, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=347), generated with kicad-footprint-generator JST EH series connector, 504050-0591 (http://www.molex.com/pdm_docs/sd/5040500891_sd.pdf), generated with kicad-footprint-generator connector Hirose BM24 series connector, B1B-XH-AM, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-135-02-xx-DV-PE-LC, 35 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0230, 2 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 1 mm² wires, reinforced insulation, conductor diameter 1.7mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST VH vertical JST ZE series connector, LY20-24P-DLT1, 12.

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