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MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (http://www.fujitsu.com/downloads/MICRO/fsa/pdf/products/memory/fram/MB85RS16-DS501-00014-6v0-E.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 09-65-2048, 4 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 32 pins, through hole 2.25mm, height 8, Wuerth electronics 97730456330 (https://katalog.we-online.com/em/datasheet/97730456330.pdf), generated with kicad-footprint-generator connector wire 2.5sqmm strain-relief Soldered wire connection with double feed through strain relief, for 6 times 0.5 mm² wires, basic insulation, conductor diameter.

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