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SSOP16: plastic shrink small outline package; 44 leads; body width 3.9 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot487-1_po.pdf HTSSOP, 38 Pin (JEDEC MO-153 Var FF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 2.4mm, see http://www.philmore-datak.com/mc/Page%20197.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00299, 3 pins, single row style2 pin1 right Through hole angled socket strip, 2x11, 2.54mm pitch, double rows Through hole socket strip SMD 1x22 2.54mm single row style2 pin1 right Through hole angled socket strip SMD 2x19 1.00mm double row Through hole angled pin header, 1x09, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x23 1.27mm single row Through hole angled pin header, 1x26, 2.54mm pitch, 6mm pin length, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole socket strip THT 1x26 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x32 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x24, 2.54mm pitch, DIN 41651 / IEC.

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