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Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, S-PVSON-N10, DRC, http://www.ti.com/lit/ds/symlink/tps61201.pdf 3x3mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems 24-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil Socket 3M 28-pin zero insertion force socket, though-hole, row spacing 6.73 mm (264 mils), body size 9.78x17.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 2x-dip-switch SPST Copal_CHS-02B, Slide, row.

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