Labels Milestones
BackPlastic HTSSOP (4.4x5x1.2mm); Thermal pad with vias HTSSOP, 20 Pin (JEDEC MO-153 Var DC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec.
- Multiwatt-7 staggered type-1 TO-220F-9 Vertical RM 2.54mm TO-126-3.
- 1.4x1mm Pitch0.35mm http://www.ti.com/lit/ds/symlink/pca9306.pdf Maxim Integrated TSOC-6.