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To EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 56 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 24 leads; body width 3.9 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SS)-5.30 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_12_05-08-1725.pdf DE/UE Package; 12-Lead Plastic DFN (5mm x 5mm) (see http://www.everspin.com/file/236/download DFN8 2x2, 0.5P; CASE 505AB (see ON Semiconductor 122BS.PDF PQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Inductor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator JST ZE series connector, B11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 44 Pin.

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