Labels Milestones
Back300mil 8-lead dip package, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic Micro Small Outline (SM) - 5.28 mm Body [QFN]; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81.
- 3299W Potentiometer, horizontal, Piher PC-16 Single Potentiometer, vertical.
- Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variant VEED-6.