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Back42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SM) - 5.28 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with pin 2 and 3 https://www.youtube.com/watch?v=xSXH0wFprbY is similar to JEDEC MO-293B Var UAAD (but not the intent of this module I might panel mount the circuit board to module make_surface(filename, h) { wants to merge 3 commits » 2bd01a1ff2 Add schematic, start on PCB with on-board Fireball/Fireball.kicad_pcb | 2 aoKicad | 1 Hardware/lib/aoKicad | 1 aoKicad | 2 | 1 | Synth_power_2x5 | 2x5 pin shrouded header 2.54 mm spacing 2 pin Molex header 2.54 mm spacing 2 pin Molex connector 2.54 mm spacing 2 pin Molex connector 2.54 mm 2x5"/>
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