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MC_1,5/4-G-3.5; number of steps (sw11 // step rotary switch - 7mm, with 3-4mm extra space - micro toggle switch - number of pins: 10; pin pitch: 3.81mm; Angled || order number: 1777109 12A || order number: 1827994 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/11-GF-3.81; number of pins: 06; pin pitch: 3.81mm; Angled || order number: 1843664 8A 160V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/8-GF-7,62; number of pins: 11; pin pitch: 3.50mm; Angled || order number: 1924185 16A (HC Generic Phoenix Contact connector footprint for: MSTB_2,5/14-GF; number of pins: 09; pin pitch: 7.62mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1757572 12A Generic Phoenix Contact connector footprint for: MSTBV_2,5/3-GF; number of pins: 12; pin pitch: 7.50mm; Vertical || order number: 1829251 12A 630V Generic Phoenix Contact connector footprint for: MSTBV_2,5/6-GF-5,08; number of pins: 07; pin pitch: 5.08mm; Vertical || order number: 1843884 8A 160V Generic Phoenix Contact SPT 1.5/7-H-3.5 Terminal Block, 1719341 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719341), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 24 Pin (JEDEC MO-153 Var FE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Tantalum Capacitor SMD 1210 (3225 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://ecsxtal.com/store/pdf/ECS-MPI2520-SMD-POWER-INDUCTOR.pdf), generated with kicad-footprint-generator Hirose series connector, BM06B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B6B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0330, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3.9 mm; lead pitch 0.65 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 18 leads; body width 4.4 mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead.

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