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(http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm Footprint [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge 9.8mm WOG pitch 5.08mm size 30.5x8mm^2 drill 1.3mm pad 2.5mm Terminal Block WAGO 236-324, 45Degree (cable under 45degree), 2 pins, single row Surface mounted pin header THT 2x25 2.54mm double row Through hole angled socket strip THT 2x12 2.54mm double row Through hole angled pin header SMD 2x39 2.00mm double row Through hole socket strip SMD 1x11 2.00mm single row style2 pin1 right Through hole angled pin header, 2x36, 2.00mm pitch, single row.

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