Labels Milestones
BackStrip, LSHM-110-xx.x-x-DV-S, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2111, 11 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 1 mm² wires, basic insulation, conductor diameter 0.9mm, length 10.0mm, width 2.4mm solder Pin_ with flat with hole, hole diameter 1.0mm test point wire loop wire loop as test Point, square 2.0mm side length SMD pad as test point, loop diameter 3.8mm, hole diameter 1.4mm wire loop as test Point, diameter 5.0mm z-position of LED center 1.6mm, 2 pins, diameter 5.0mm z-position of LED center 3.0mm, 2 pins, pitch 5mm, size 55x9mm^2, drill diamater 1.1mm, pad diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter.
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