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Http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Molded Wide transistor TO-92L leads in-line (large body variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-92 2-pin leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 32 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 5.08mm 7.62mm 300mil.

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