Labels Milestones
Back100-Lead Plastic Thin Shrink Small Outline (SS)-5.30 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf.
- Vertex -8.40938 5.61897 2.58057 facet.
- 1.029044e-01 6.892302e-03 9.946674e-01 facet normal -3.694615e-15 -4.690112e-15.
- MC_1,5/12-G-3.5; number of pins: 02.