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Omron_A6S-510x, Slide, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://www.vishay.com/docs/91361/hexdip.pdf THT DIP DIL PDIP 2.54mm 10.16mm 400mil SMDSocket SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MD MOSFET Infineon PLCC, 20 pins, surface mount SMD package TO-269AA (e.g. Diode bridge), see http://www.vishay.com/docs/88854/padlayouts.pdf SMD diode bridge Single phase bridge rectifier case 15.2x15.2mm, pitch 10.9mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/pb1000.pdf Single phase bridge rectifier case 28.6x28.6mm, pitch 18.0mm & 11.6mm, see https://diotec.com/tl_files/diotec/files/pdf/datasheets/kbpc1500fw.pdf Diotec 32x5.6x17mm rectifier package, 5.08mm pitch, single row Through hole angled pin header, 2x37, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip, 2x38, 2.54mm pitch, 6mm pin length, double rows Through hole angled socket strip SMD Solder 3-pad Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 1 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip, labeled with numbers SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, pads 1-2 Bridged2Bar with 2 copper strip SMD 1x14 2.00mm single row male, vertical entry Harwin LTek Connector, 16 pins, pitch 5mm, size 55x7.6mm^2, drill diamater 1.15mm, pad diameter 2.6mm, see http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf, script-generated using.

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