Labels Milestones
BackWLCSP-132, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf.
- UTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball.
- Normal -1.575938e-001 -2.757892e-001 9.482112e-001 facet normal -0.0808315.