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Pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 48 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Stretched Small Outline (SO) - Wide, 7.50 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm, hand-soldering variant with enlarged pads (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-15, Vertical, RM 5.475mm, SOT-93, see https://www.vishay.com/docs/95214/fto218.pdf TO-218-3 Horizontal RM 10.95mm SOT-93 TO-218-3, Vertical, RM 1.27mm, staggered type-2, see http://www.ti.com/lit/ds/symlink/lm3886.pdf TO-220F-11 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220F-7 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220F-9, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Vertical RM 2.54mm TO-220-4, Horizontal, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 5.08mm, see http://cdn-reichelt.de/documents/datenblatt/A400/W005M-W10M_SEP.PDF diode bridge Low Profile DFS "Flat", see http://www.vishay.com/docs/88874/dfl15005.pdf SMD diode bridge package, diameter 9.0mm, pin pitch 2.50mm diameter 10.5mm Tantal Electrolytic Capacitor, .

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