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Mm Footprint [HTQFP] thermal pad 3x2mm Pitch 0.5mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm SON, 8-Leads, Body 5x6x1mm, Pitch 1.27mm; (see Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 2x33, 2.54mm pitch, single row Through hole IDC header, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header, 2x16, 2.54mm pitch, double rows Through hole IDC header, 2x12, 1.00mm pitch, 2.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x18 2.00mm single row style2 pin1 right Through hole angled pin header, 1x23, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header SMD 1x09 2.54mm single row (from Kicad 4.0.7!), script generated Through hole angled pin header THT 1x15 5.08mm single row Through hole IDC box header 2x06 2.54mm double row surface-mounted straight pin header, 1x12, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x28 2.54mm double row Through hole.

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