Labels Milestones

Back

For Mini-Circuits case TTT167 (Mini-Circuits_TTT167_LandPatternPL-079) following land pattern PL-230, including GND vias.

• IMAGE.png' Delete '3D Printing/AD&D 1e.
• Specification 00000049BS.pdf DFN package size 62x19.5x14mm.
• 3.547643e-04 vertex -9.858924e+01 1.059924e+02 1.855000e+01 vertex.

New Pull Request

0 Open 0 Closed

Label

Show archived labels

Use alt + click/enter to exclude labels

All labels No label

Milestone

All milestones No milestones

Project

All projects No project

0 Open 0 Closed

Close

Label

Clear labels

Milestone

No milestone

Projects

Clear projects