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(http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x13 1.27mm single row Through hole angled pin header SMD 2x15 1.00mm double row surface-mounted straight socket strip, 2x23, 2.00mm pitch, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 2x14 2.54mm double row Through hole pin header SMD 2x14 1.00mm double row surface-mounted straight socket strip, 2x26, 2.54mm pitch, 6mm pin length, single row Through hole angled socket strip, 1x02, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x35 2.54mm single row.

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