synth_tools

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MCV_1,5/13-G-3.81; number of pins: 13; pin pitch: 5.08mm; Vertical || order number: 1924622 16A (HC Generic Phoenix Contact SPT 2.5/11-H-5.0-EX 1732470 Connector Phoenix Contact connector footprint for: GMSTBA_2,5/9-G; number of pins: 08; pin pitch: 3.81mm; Angled; threaded flange || order number: 1829222 12A 630V Generic Phoenix Contact connector footprint for: MSTB_2,5/14-GF-5,08; number of pins: 13; pin pitch: 5.00mm; Vertical; threaded flange || order number: 1829183 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/7-GF-3.81; number of pins: 10; pin pitch: 7.50mm; Angled || order number: 1836383 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/9-GF-3.5; number of pins: 10; pin pitch: 3.81mm; Vertical || order number: 1803390 8A 160V Generic Phoenix Contact connector footprint for: MSTBA_2,5/8-G; number of pins: 11; pin pitch: 5.00mm; Angled || order number: 1803426 8A 160V Generic Phoenix Contact connector footprint for: MC_1,5/15-GF-3.81; number of pins: 13; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1766343 12A 630V Generic Phoenix Contact SPT 5/11-H-7.5-ZB Terminal Block, 1732399 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732399), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0410, with PCB locator, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1230, 12 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator JST SHL series connector, S3B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 5268-15A, 15 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 7x-dip-switch SPST , Piano, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST Copal_CHS-06B, Slide, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row.

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