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ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm.

6/15/25/50/75-NP Current Transducer, https://www.lem.com/sites/default/files/products_datasheets/cksr_75-np.pdf LEM HO.
For: MSTBV_2,5/4-GF-5,08; number of pins: 04.
-0.901636 0.420949 0.0992679 facet normal 9.996590e-01.
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Vertex -5.451008e-003 5.862898e+000 2.486861e+001 facet.

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