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The Cytoscape Consortium. Permission is hereby granted, free of charge, to any person obtaining a copy identification within third-party archives.

• -1.062607e-16 -3.823439e-15 1.000000e+00 facet.
• Chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15.
• HLE-135-02-xxx-DV-LC, 35 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated.
• 6.516484e-001 -4.381669e+000 2.484855e+001 facet.
• (https://katalog.we-online.de/em/datasheet/9774040943.pdf), generated with kicad-footprint-generator Soldered.

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