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Both GND) 6x Sockets, 2pin: - reset Pots, 3-pin: - Glide attenuator (B10k) (join two left pins from below Pots, 2-pin: - Glide, manual (A100k) (two left pins, from below) - Clock rate goes down when resistance goes up, opposite to expectation. Schematic fixes: - C1 is too small for film; is film needed? - Smaller cap (476nF?) for C1 Ceramic 104s for C10, C14, might be fine, might introduce intermittents From c96644890cf0985bb0d02bb542ef75a0a00d53f2 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Added input resistor for sync; placed everything on PCB with exploratory 8hp layout Add schematic, start on PCB 7f9b624c8e tweaks layout with input from sam 7f9b624c8e1f1f65b5263dc5de76990cc9e84778 scale([.38,.38,-.005]) surface("FireballSpellVertSmaller.png", center=true, invert=false); Am totally not using git correctly Futura BT font files The body text, captions, etc. For AD&D 1e spell names in Filmoscope Quentin/Panels' 2cbdb94ba9 Go to file From 1e09530d973ad09b2f481221728128715527464a Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add a front-panel PCB Add four more switches/buttons, move LED drivers onto PCB added the once through idea with commentary by Correcting changed filename in .prl 54f1a61ba5 gets jiggy with PCB cutout, light-direction downwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf Laser Diode, TO-3.3mm, 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO5-like (D=9mm), 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-56, 3pin lightpipe triple tower right angle SPDT push button https://www.e-switch.com/system/asset/product_line/data_sheet/210/800U.pdf CuK miniature slide switch, OS series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, with thermal vias; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 324.

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