Labels Milestones
Back289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing.
- -2.797506e-01 vertex -1.092962e+02 9.725134e+01 1.173829e+01 vertex -1.093546e+02 9.665134e+01.
- 10688 pitch 3.5mm size 43x8.3mm^2 drill 1.3mm pad.
- Normal 4.866825e-001 -8.343562e-001 2.588238e-001.
- HO 8/15/25-NSM Current Transducer (https://www.lem.com/sites/default/files/products_datasheets/ho-np_0100__1100_series.pdf LEM HTFS x00-P.