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Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline No-Lead 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic DFN (2mm x 2mm) (see Linear Technology 05081707_A_DHD16.pdf DH Package; 16-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_12_05-08-1723.pdf DFN.

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