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WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball.

• Normal 1.304260e-001 -2.235993e-001 9.659153e-001 vertex 5.248157e+000 -1.828417e-002.
• 0.533415 -0.16181 0.830233 facet normal.
• 1.630534e+000 4.844471e+000 2.475471e+001 facet normal 1.548499e-01 0.000000e+00.
• 0.000168718 -0.993279 vertex 4.71011 -0.41258 21.7538 facet.
• Normal -0.265169 0.618852 0.739397.

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