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2.5x1.0mm_ Pitch 0.5mm LFCSP, 16 Pin package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 1x05 1.27mm single row Through hole straight pin header, 2x39, 1.27mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header SMD 1x34 1.27mm single row style2 pin1 right Through hole straight pin header, 1x17, 2.54mm pitch, double rows Through hole straight socket strip, 2x17, 1.00mm pitch, double rows Surface mounted socket strip.

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