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Connector, B6B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0110, 11 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1106, With thermal vias in pads, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XH series connector, B16B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 5268-02A, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST PH series connector, 502382-0770 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator JST PHD series connector, 64801011622 (https://katalog.we-online.com/em/datasheet/6480xx11622.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 01005 (0402 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xxx-DV-BE, 22 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SH series connector, B03P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from.

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