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(JQ) - 4x4x0.5 mm Body [HTSSOP], with thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16: plastic shrink small outline package; 32 leads; body width 3.9 mm; lead pitch 0.635; (see NXP sot054_po.pdf TO-92 leads in-line.

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