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HLE-115-02-xxx-DV, 15 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 11.6, Wuerth electronics 9771140360 (https://katalog.we-online.com/em/datasheet/9771140360.pdf), generated with kicad-footprint-generator JST XA series connector, S26B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator JST PH series connector, S04B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a full bridge rectifier; could use fewer caps that way Latest commits for file Schematics/SynthMages.pretty/PinSocket_1x02_P2.54mm_Vertical.kicad_mod Latest commits for file VCO_MANUAL_v2.pdf 2015-02-23 19:36:11 -0800 08c0726655 2015-02-23 04:32:30 -0800 01f0c6a8ec 2015-02-23 04:26:05 -0800 5663c8bc86 2015-02-23 04:25:44 -0800 e89a2a057d From d952ec97f3d5e1172c33dcefe438ee5d18f8d87d Mon Sep 17 00:00:00 2001 Subject: [PATCH] Add design rules for jlcpcb Latest commits for file Envelope/Envelope.kicad_sch master PSU/Synth Mages Power Word Stun.kicad_sch SD, SMD, reverse on-board, right-angle, push-pull (https://www.hirose.com/product/en/download_file/key_name/DM3AT-SF-PEJM5/category/Drawing%20(2D)/doc_file_id/44099/?file_category_id=6&item_id=06090031000&is_series= Micro SD, SMD, top-mount, push-push (https://www.hirose.com/product/document?clcode=CL0609-0004-8-82&productname=DM1AA-SF-PEJ(82)&series=DM1&documenttype=2DDrawing&lang=en&documentid=0000915301 Hirose FH41, FFC/FPC connector, FH12-50S-0.5SH, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON6 3*3 MM, 0.95 PITCH; http://www.ti.com/lit/ds/symlink/lmr62421.pdf 8-Lead Plastic Dual Flat, No Lead Package (MA) - 2x2x0.9 mm Body [TSSOP] with exposed pad 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 18-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7.

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