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43160-1106, With thermal vias in pads, 3 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, through hole THT Kemet EC2 signal relay DPDT double dual coil latching surface mount PLCC.

• -0.84015 0.533179 0.0993412 facet.
• Normal -0.99513 -0.0985702 1.41413e-05 facet normal -0.5865 0.714682.
• Pin-PCB-offset 9.4mm 62-pin D-Sub connector.
• -0.314934 0.485556 -0.815507 vertex 1.60745.
• 0.780252 0.0331891 0.624584 facet.

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