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Kendryte K210 RISC-V Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=303, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A BGA 238 0.5 CPG238 Spartan-7 BGA, 14x14 grid, 8x8mm package, pitch 0.5mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f469ni.pdf WLCSP-180, 13x14 raster, 5.537x6.095mm package, pitch 0.4mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.5mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 10x10mm package, pitch 0.5mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 2.965x2.965mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 15.24 mm (600 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 5.25mm 206mil JPin SMD 1x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 40-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 4x-dip-switch SPST CTS_Series194-4MSTN, Piano, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 15.24.

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