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Ball, 32x32 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout.

• 0.0580283 0.994019 vertex 0.0587368 -7.36167.
• -4.69689 4.43444 7.32632 facet normal -0.952376 -0.288901.
• Plane. - when two traces.
• 0.560077 0.682457 0.469645 vertex -4.93725 -7.38912.

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