Labels Milestones
Back18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size.
- (http://www.molex.com/pdm_docs/sd/2026560021_sd.pdf), generated with kicad-footprint-generator JST ZE series.
- Transformer, 50 ohm, 4.5 to.