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0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad.

• Button_Switch_SMD SW_SPDT_CK-JS102011SAQN Sub-miniature slide.
• 5W length 21.3mm width 4.8mm Resistor, Bare_Metal_Element.
• Diameter=5mm, height=5mm, Non-Polar Electrolytic Capacitor C Radial.

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