Labels Milestones
Back32-Lead Frame Chip Scale Package LFCSP (5mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (ST)-4.4 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin.
- -8.134759e-001 3.495393e-001 facet normal -0.0980237 -0.995112.
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