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BackRND 205-00016, 6 pins, dual row male, vertical entry Harwin LTek Connector, 5 pins, pitch 5.08mm, size 20.3x8.45mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00012_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block Phoenix MKDS-3-15-5.08 pitch 5.08mm size 20.3x8.45mm^2 drill 1.1mm pad 2.1mm Terminal Block WAGO 236-414, 45Degree (cable under 45degree), 6 pins, pitch 7.5mm, size 66.5x15mm^2, drill diamater 1.15mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.75 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1 mm² wire, basic insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for ECP5 FPGAs, based on the GitHub page (they'll have "@ something" after them) and download them as separate sheet 969311f00cbb6d6ece9a25b5fb1d4e2884e468c0 Module Spellbook Pages Fab Plant Research Pages Fab Plant Research Table of Contents Samba Reggae 2 and 13 removed for voltage dividers feeding chip inputs don't do manual connection to GND if you are using Eurorack thickness = 2; // plastic walls are 2mm 3D Printing/Pot_Knobs/knob_docs.scad Executable file View File 3D Printing/Panels/HOLD PORTAL.png and /dev/null differ a3d4f2b82e romps with traces, vias, and net links Panels/FireballSpellVertSmall.png Normal file Unescape Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-MaskTop.gts Normal file View File Schematics/Fireball.kicad_sch Normal file View File Schematics/Kassutronics_Slope_Build_Docs_2.0A.pdf Normal file Unescape Schematics/Enlarge/Enlarge.kicad_pro Normal file View File 3D Printing/Cases/Eurorack 2-Row/eurorack_2row_power_supply_base.skp Executable file Unescape left_rib_x = thickness * 1; right_rib_x = width_mm - thickness*2; .
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