Labels Milestones
Back40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP Switch SPST Slide 5.08mm 200mil SMD JPin SMD 8x-dip-switch SPST KingTek_DSHP08TJ, Slide, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET LA MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET LA MOSFET Infineon PLCC, 20 pins, through hole, DF11-20DP-2DSA, 10 Pins per row (http://www.molex.com/pdm_docs/sd/460071105_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-129-02-xxx-DV-BE-A, 29 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated.
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