Labels Milestones
Back1924596 16A (HC Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/7-G; number of pins: 03; pin pitch: 5.00mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1830729 8A 160V Generic Phoenix Contact connector footprint for: GMSTBVA_2,5/6-G-7,62; number of pins: 11; pin pitch: 7.62mm; Vertical; threaded flange || order number: 1766246 12A 630V Generic Phoenix Contact SPT 2.5/6-H-5.0 1991011 Connector Phoenix Contact, SPT 2.5/3-H-5.0-EX 1732399 Connector Phoenix Contact, SPT 2.5/7-H-5.0 Terminal Block, 1751066 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1751066), generated with kicad-footprint-generator ipc_noLead_generator.py WSON-10 package 2x3mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf VFBGA-49, 7x7, 5x5mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.ti.com/lit/ml/mpbg777/mpbg777.pdf BGA 289 0.8 ZAV S-PBGA-N289 Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted pin header SMD 1x12 2.00mm single row style2 pin1 right Through hole angled pin header SMD 1x24 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x30 2.00mm single row style2 pin1 right Through hole pin header THT 1x31 2.00mm single row style2 pin1 right Through hole straight pin header, 1x16, 2.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x02 2.54mm double row Through hole pin header THT 1x36 2.00mm single row Through hole straight pin header.
New Pull Request