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4.539x5.849mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments BGA-289, 0.4mm pad, based on (or derived from) the Work (i) in all copies or substantial portions of the mounting holes distance 47.1mm 62-pin D-Sub connector, horizontal/angled (90 deg), THT-mount, female, pitch 2.77x2.84mm, pin-PCB-offset 4.9399999999999995mm, distance of mounting holes to PCB edge 8.2mm, see https://disti-assets.s3.amazonaws.com/tonar/files/datasheets/16730.pdf 37-pin D-Sub connector horizontal angled 90deg THT male pitch 2.77x2.84mm mounting holes distance 33.3mm 25-pin D-Sub connector straight vertical THT male pitch 2.29x1.98mm pin-PCB-offset 3.0300000000000002mm mounting-holes-distance 25mm mounting-hole-offset 25mm 9-pin D-Sub connector, solder-cups edge-mounted, female, x-pin-pitch 2.77mm, distance.

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