Labels Milestones
BackSeries, http://cdn-reichelt.de/documents/datenblatt/B400/XO53.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD.
- DHC Package; 18-Lead Plastic DFN (4mm x 3mm.
- -4.29047 5.40904 7.37319 vertex 6.94378.
- = 1/5" = 5.08mm // u[nits] # precadsr.sch.