Labels Milestones
Back6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 0.9mm staggered type-2 TO-220F-15 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-2 TO-220-9 Horizontal RM 2.54mm staggered type-2 TO-220-5, Vertical, RM 1.7mm, MultiwattF-11, staggered type-2, see.
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