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For: MSTBV_2,5/16-GF-5,08; number of pins: 13; pin pitch: 3.50mm; Angled || order number: 1829170 12A 630V Generic Phoenix Contact connector footprint for: GMSTBA_2,5/4-G-7,62; number of pins: 05; pin pitch: 5.00mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1777167 12A || order number: 1776605 12A || order number: 1924499 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/7-G-5.08; number of pins: 03; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1843923 8A 160V Generic Phoenix Contact connector footprint for: MSTBVA_2,5/5-G-5,08; number of pins: 13; pin pitch: 3.50mm; Vertical || order number: 1776883 12A || order number: 1843237 8A 160V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/6-GF-7,62; number of pins: 09; pin pitch: 7.62mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1829154 12A 630V Generic Phoenix Contact connector footprint for: MCV_1,5/8-GF-5.08; number of pins: 05; pin pitch: 3.81mm; Vertical || order number: 1830606 8A 160V Generic Phoenix Contact SPT 2.5/6-H-5.0 Terminal Block, 1751066 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1751066), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 2.54 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), body size 10.8x21.88mm 8x-dip-switch SPST , Piano, row spacing 7.62 mm.

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