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BackCube([14,14,thickness]); // 1HP = 1/5" = 5.08mm // u[nits] # precadsr.sch BOM Optional capacitor socket # Temporary files *.lck # KiCad backups folders temp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) Total plated.
- Http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink.
- Vertex -4.42088 5.07598 7.17947 vertex 5.11681 4.57918.