Labels Milestones
Back1.86x1.36mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.nxp.com/docs/en/package-information/98ASA00869D.pdf#page=1 MAPBGA 14x14x1.18 PKG, 14.0x14.0mm, 289 Ball, 17x17 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; see section 7.5 of.
- D52M ANT SoC Module https://www.thisisant.com/assets/resources/D00001687_D52_Module_Datasheet.v.2.3_(Garmin).pdf.
- Size 105x9mm^2, drill diamater 1.1mm, pad diameter.
- 4 Schematics/Unseen Servant/Unseen Servant.kicad_pcb create mode 100644.
- 3.0mmx3.0mm Inductor, Wuerth Elektronik.