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BGA YZR0009 Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center ball grid, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100489.PDF WLCSP-25, 5x5 raster, 2.097x2.493mm package, pitch 0.5mm; see section 7.7 of http://www.st.com/resource/en/datasheet/DM00330506.pdf WLCSP-100, 10x10 raster, 4.618x4.142mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.029x3.029mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.623x3.651mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (JEDEC MS-013AE, https://www.analog.com/media/en/package-pcb-resources/package/35833120341221rw_28.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: AE-6410-14A example for new mpn: 39-28-x22x, 11 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Molex.

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